Flexible Multi Sensor Inspection System For Solder Joint Analysis
نویسندگان
چکیده
This paper describes the design and construction of an open automated solder bond veri cation machine for the electronics manufacturing industry The application domain is the higher end assembly technologies with an emphasis on ne pitch surface mount components The system serves a measurement function quantifying the solder bonds It interfaces with the manufacturing process to close the manufacturing loop A geometric model of the solder in a joint coupled with a nite element analysis of the physical properties of solder lead to objective measurement of the solder Principle illumination systems are laser X ray and noncoherent lighting Open Objected Oriented design and implementation practices enable a forward looking system to be developed
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Automated Visual Inspection Algorithm for Solder Joint of Surface Mount Devices Based on Three Dimensional Shape Analysis
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